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MX29F200C T/B
2M-BIT [256Kx8/128Kx16] CMOS FLASH MEMORY
FEATURES
* * * * * 5.0V10% for read, erase and write operation 131072x16/262144x8 switchable Fast access time: 55/70/90ns Compatible with MX29F200T/B device Low power consumption - 40mA maximum active current@5MHz - 1uA typical standby current Command register architecture - Byte/Word Programming (9us/11us typical) - Sector Erase (16K-Bytex1, 8K-Bytex2, 32K-Bytex1, and 64K-Byte x3) Auto Erase (chip & sector) and Auto Program - Automatically erase any combination of sectors or the whole chip with Erase Suspend capability. - Automatically program and verify data at specified address Status Reply - Data# Polling & Toggle bit for detection of program and erase cycle completion. Ready/Busy# pin(RY/BY#) - Provides a hardware method or detecting program or erase cycle completion Compatibility with JEDEC standard - Pinout and software compatible with single-power supply Flash - Superior inadvertent write protection * Sector protection - Hardware method to disable any combination of sectors from program or erase operations - Temporary sector unprotect allows code changes in previously locked sectors * Sector protect/chip unprotect for 5V only system * 100,000 minimum erase/program cycles * Latch-up protected to 100mA from -1V to VCC+1V * Boot Code Sector Architecture - T = Top Boot Sector - B = Bottom Boot Sector * Low VCC write inhibit is equal to or less than 3.2V * Erase suspend/ Erase Resume - Suspends an erase operation to read data from, or program data to a sector that is not being erased, then resume the erase operation. * Hardware reset pin - Resets internal state mechine to the read mode * 20 years data retention * Package type: - 44-pin SOP - 48-pin TSOP - All Pb-free devices are RoHS Compliant
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GENERAL DESCRIPTION
The MX29F200C T/B is a 2-mega bit, single 5 Volt Flash memory organized as 1M word x16 or 2M bytex8 MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29F200C T/B is packaged in 44-pin SOP and 48pin TSOP. It is designed to be reprogrammed and erased in-system or in-standard EPROM programmers. The standard MX29F200C T/B offers access time as fast as 55ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29F200C T/B has separate chip enable (CE#) and output enable (OE# ) controls. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29F200C T/B uses a command register to manage this functionality. The command register allows for 100% TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maximum EPROM compatibility. MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and programming operations produces reliable cycling. The MX29F200C T/B uses a 5.0V 10% VCC supply to perform the High Reliability Erase and auto Program/Erase algorithms. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamps on address and data pin from -1V to VCC + 1V.
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PIN CONFIGURATIONS
44 SOP(500mil)
NC RY/BY# NC A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC
PIN DESCRIPTION
SYMBOL A0-A16 Q0-Q14 Q15/A-1 CE# OE# RESET# WE# RY/BY# BYTE# VCC GND NC PIN NAME Address Input Data Input/Output Q15(Word mode)/LSB addr.(Byte mode) Chip Enable Input Output Enable Input Hardware Reset Pin, Active low Write Enable Input Read/Busy Output Word/Byte Selection Input Power Supply Pin (+5V) Ground Pin Pin Not Connected Internally
48 TSOP(TYPE I) (12mm x 20mm)
A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC NC A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0
A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC NC A7 A6 A5 A4 A3 A2 A1
MX29F200C T/B
MX29F200C T/B (NORMAL TYPE)
MX29F200C T/B (REVERSE TYPE)
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SECTOR STRUCTURE
MX29F200CT Top Boot Sector Addresses Tables Sector Size (Kbytes/ A16 SA0 SA1 SA2 SA3 SA4 SA5 SA6 0 0 1 1 1 1 1 A15 0 1 0 1 1 1 1 A14 X X X 0 1 1 1 A13 X X X X 0 0 1 A12 X X X X 0 1 X Kwords) 64/32 64/32 64/32 32/16 8/4 8/4 16/8 (x8)Address Range 00000h-0FFFFh 10000h-1FFFFh 20000h-2FFFFh 30000h-37FFFh 38000h-39FFFh 3A000h-3BFFFh 3C000h-3FFFFh (x16) Address Range 00000h-07FFFh 08000h-0FFFFh 10000h-17FFFh 18000h-1BFFFh 1C000h-1CFFFh 1D000h-1DFFFh 1E000h-1FFFFh Address Range (in hexadecimal)
MX29F200CB Bottom Boot Sector Addresses Tables Sector Size (Kbytes/ A16 SA0 SA1 SA2 SA3 SA4 SA5 SA6 0 0 0 0 0 1 1 A15 0 0 0 0 1 0 1 A14 0 0 0 1 X X X A13 0 1 1 X X X X A12 X 0 1 X X X X Kwords) 16/8 8/4 8/4 32/16 64/32 64/32 64/32
Address Range (in hexadecimal) (x8)Address Range 00000h-03FFFh 04000h-05FFFh 06000h-07FFFh 08000h-0FFFFh 10000h-1FFFFh 20000h-2FFFFh 30000h-3FFFFh (x16) Address Range 00000h-01FFFh 02000h-02FFFh 03000h-03FFFh 04000h-07FFFh 08000h-0FFFFh 10000h-17FFFh 18000h-1FFFFh
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BLOCK DIAGRAM
WRITE CE# OE# WE# CONTROL INPUT LOGIC HIGH VOLTAGE MACHINE (WSM) PROGRAM/ERASE STATE
X-DECODER
STATE FLASH ARRAY ARRAY REGISTER
ADDRESS LATCH A0-A16 AND BUFFER
SENSE AMPLIFIER A-1/Q15
Y-DECODER
Y-PASS GATE
SOURCE HV COMMAND DATA DECODER
PGM DATA HV COMMAND DATA LATCH
PROGRAM DATA LATCH
Q0-Q14
I/O BUFFER
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AUTOMATIC PROGRAMMING The MX29F200C T/B is byte programmable using the Automatic Programming algorithm. The Automatic Programming algorithm does not require the system to time out sequence or verify the data programmed. The typical chip programming time of the MX29F200C T/B at room temperature is less than 4.5 seconds.
AUTOMATIC ERASE ALGORITHM MXIC's Automatic Erase algorithm requires the user to write commands to the command register using standard microprocessor write timings. The device will automatically pre-program and verify the entire array. Then the device automatically times the erase pulse width, verifies the erase and counts the number of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the status of the programming operation. Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches addresses and data needed for the programming and erase operations. During a system write cycle, addresses are latched on the falling edge, and data are latched on the rising edge of WE#. MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29F200C T/B electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by using the EPROM programming mechanism of hot electron injection. During a program cycle, the state-machine will control the program sequences and command register will not respond to any command set. During a Sector Erase cycle, the command register will only respond to Erase Suspend command. After Erase Suspend is complete, the device stays in read mode. After the state machine has completed its task, it will allow the command register to respond to its full command set.
AUTOMATIC CHIP ERASE The entire chip is bulk erased using 10 ms erase pulses according to MXIC's Automatic Chip Erase algorithm. Typical erasure at room temperature is accomplished in less than two second. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are internally controlled by the device.
AUTOMATIC SECTOR ERASE The MX29F200C T/B is sector(s) erasable using MXIC's Auto Sector Erase algorithm. Sector erase modes allow sectors of the array to be erased in one erase cycle. The Automatic Sector Erase algorithm automatically programs the specified sector(s) prior to electrical erase. The timing and verification of electrical erase are internally controlled by the device.
AUTOMATIC PROGRAMMING ALGORITHM MXIC's Automatic Programming algorithm requires the user to only write program set-up commands (include 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times the programming pulse width, verifies the program, and counts the number of sequences. A status bit similar to Data# Polling and a status bit toggling between consecutive read cycles, provides feedback to the user as to the status of the programming operation.
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COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 1 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. Either of the two reset command sequences will reset the device(when applicable).
TABLE 1. SOFTWARE COMMAND DEFINITIONS
First Bus Command Bus Cycle Reset Read Read Silicon ID Word Byte Sector Protect Verify Byte 4 AAAH AAH 555H 55H AAAH 90H Word 1 1 4 4 4 Cycle Addr Data Second Bus Cycle Addr Data Third Bus Cycle Addr Data Fourth Bus Cycle Addr Data Fifth Bus Cycle Addr Data Sixth Bus Cycle Addr Data
XXXH F0H RA 555H RD AAH 2AAH 55H 555H 55H 555H 90H ADI ADI (SA) X02H (SA) X04H DDI DDI XX00H XX01H 00 01 PD PD AAH AAH AAH AAH 2AAH 55H 555H 55H 555H 10H AAAH 10H SA SA 30H 30H
AAAH AAH 555H AAH
AAAH 90H 555H 90H
2AAH 55H
Program
Word Byte
4 4 6 6 6 6 1 1 6
555H
AAH
2AAH 55H 555H 55H
555H
A0H
PA PA 555H AAAH 555H AAAH
AAAH AAH 555H AAH
AAAH A0H 555H 80H
Chip Erase
Word Byte
2AAH 55H 555H 55H
AAAH AAH 555H AAH
AAAH 80H 555H 80H
Sector Erase
Word Byte
2AAH 55H 555H 55H
2AAH 55H 555H 55H
AAAH AAH XXXH B0H XXXH 30H 555H AAH
AAAH 80H
Sector Erase Suspend Sector Erase Resume Unlock for sector protect/unprotect
2AAH 55H
555H
80H
555H
AAH
2AAH 55H
555H 20H
NOTES: 1. ADI = Address of Device identifier; A1=0, A0 =0 for manufacture code, A1=0, A0 =1 for device code.(Refer to Table 3) DDI = Data of Device identifier : C2H for manufacture code,51H/57H(x8) and 2251H/2257H(x16) for device code. X = X can be VIL or VIH RA=Address of memory location to be read. RD=Data to be read at location RA. 2. PA = Address of memory location to be programmed. PD = Data to be programmed at location PA. SA = Address to the sector to be erased. 3. The system should generate the following address patterns: 555H or 2AAH to Address A0~A10. Address bit A11~A16=X=Don't care for all address commands except for Program Address (PA) and Sector Address (SA). Write Sequence may be initiated with A11~A16 in either state. 4. For Sector Protection Verify Operation : If read out data is 01H, it means the sector has been protected. If read out data is 00H, it means the sector is still not being protected.
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TABLE 2. MX29F200C T/B BUS OPERATIONS
Pins Mode Read Silicon ID Manufacturer Code(1) Read Silicon ID Device Code(1) Read Standby Output Disable Write Sector Protect without 12V system (6) Chip Unprotect without 12V system (6) Verify Sector Protect/ Unprotect without 12V system (7) Reset CE# L L L H L L L L L OE# L L L X H H H H L WE# H H H X H L L L H A0 L H A0 X X A0 X X X A1 L L A1 X X A1 X X H A6 X X A6 X X A6 L H X A9 VID(2) VID(2) A9 X X A9 H H H Q0 ~ Q15 C2H (Byte mode) 00C2H (Word mode) 51H/57H (Byte mode) 2251H/2257H(Word mode) DOUT HIGH Z HIGH Z DIN(3) X X Code(5)
X
X
X
X
X
X
X
HIGH Z
NOTES: 1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1. 2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V. 3. Refer to Table 1 for valid Data-In during a write operation. 4. X can be VIL or VIH. 5. Code=00H/0000H means unprotected. Code=01H/0001H means protected. A16~A12=Sector address for sector protect. 6. Refer to sector protect/unprotect algorithm and waveform. Must issue "unlock for sector protect/unprotect" command before "sector protect/unprotect without 12V system" command. 7. The "verify sector protect/unprotect without 12V system" is only following "Sector protect/unprotect without 12V system" command.
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READ/RESET COMMAND The read or reset operation is initiated by writing the read/ reset command sequence into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid command must then be written to place the device in the desired state. SET-UP AUTOMATIC CHIP/SECTOR ERASE COMMANDS Chip erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the "set-up" command 80H. Two more "unlock" write cycles are then followed by the chip erase command 10H. The Automatic Chip Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Chip Erase. Upon executing the Automatic Chip Erase, the device will automatically program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are completed when the data on Q7 is "1" at which time the device returns to the Read mode. The system does not require to provide any control or timing during these operations. When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array(no erase-verified command is required). If the Erase operation was unsuccessful, the data on Q5 is "1"(see Table 4), indicating an erase operation exceed internal timing limit. The automatic erase begins on the rising edge of the last WE# pulse in the command sequence and terminates when the data on Q7 is "1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode.
SILICON-ID-READ COMMAND Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacturer and device codes must be accessible while the device resides in the target system. PROM programmers typically access signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto address lines is not generally desired system design practice. The MX29F200C T/B contains a Silicon-ID-Read operation to supplement traditional PROM programming methodology. The operation is initiated by writing the read silicon ID command sequence into the command register. Following the command write, a read cycle with A1=VIL,A0=VIL retrieves the manufacturer code of C2H/ 00C2H. A read cycle with A1=VIL, A0=VIH returns the device code of 51H/2251H for MX29F200CT, 57H/2257H for MX29F200CB.
TABLE 3. EXPANDED SILICON ID CODE
Pins Code Manufacture code Device code for MX29F200CT Device code for MX29F200CB Sector Portection Verification Word Byte Word Byte Word Byte A0 VIL VIL VIH VIH VIH VIH X X A1 VIL VIL VIL VIL VIL VIL VIH VIH Q15~Q8 Q7 Q6 Q5 Q4 Q3 00H X 22H X 22H X X X 1 1 0 0 0 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 0 Q2 Q1 0 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 Q0 Code(Hex) 0 0 1 1 1 1 1 0 00C2H C2H 2251H 51H 2257H 57H 01H(Protected) 00H(Unprotected)
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SECTOR ERASE COMMANDS The Automatic Sector Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Set-up Sector Erase command and Automatic Sector Erase command. Upon executing the Automatic Sector Erase command, the device will automatically program and verify the sector(s) memory for an all-zero data pattern. The system does not require to provide any control or timing during these operations. When the sector(s) is automatically verified to contain an all-zero pattern, a self-timed sector erase and verification begin. The erase and verification operations are complete when the data on Q7 is "1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode. The system does not require to provide any control or timing during these operations. When using the Automatic Sector Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase-verified command is required). Sector erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the set-up command 80H. Two more "unlock" write cycles are then followed by the sector erase command 30H. The sector address is latched on the falling edge of WE#, while the command(data) is latched on the rising edge of WE#. Sector addresses selected are loaded into internal register on the sixth falling edge of WE#. Each successive sector load cycle started by the falling edge of WE# must begin within 30us from the rising edge of the preceding WE#. Otherwise, the loading period ends and internal auto sector erase cycle starts. (Monitor Q3 to determine if the sector erase timer window is still open, see section Q3, Sector Erase Timer.) Any command other than Sector Erase (30H) or Erase Suspend (B0H) during the timeout period resets the derice to read mode. ERASE SUSPEND This command is only valid while the state machine is executing Automatic Sector Erase operation, and therefore will only be responded to period during Automatic Sector Erase operation. Writing the Erase Suspend command during the Sector Erase time-out immediately terminates the time-out period and suspends the erase operation. After this command has been executed, the command register will initiate erase suspend mode. The state machine will return to read mode automatically after suspend is ready. At this time, state machine only allows the command register to respond to the Read Memory Array, Erase Resume and Program commands. The system can determine the status of the program operation using the Q7 or Q6 status bits, just as in the standard program operation. After an erase-suspend program operation is complete, the system can once again read array data within non-suspended sectors.
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Table 4. Write Operation Status
Status Byte Program in Auto Program Algorithm Auto Erase Algorithm Erase Suspend Read (Erase Suspended Sector) In Progress Erase Suspended Mode Erase Suspend Read Data (Non-Erase Suspended Sector) Erase Suspend Program Byte Program in Auto Program Algorithm Exceeded Time Limits Auto Erase Algorithm Erase Suspend Program Q7# Q7# 0 Q7# Data Toggle Toggle Toggle Toggle Data Data Data 0 1 1 1 N/A N/A 1 N/A N/A No Toggle Toggle N/A 1 0 0 0 0 Q7 Note1 Q7# 0 1 Q6 Toggle Toggle No Toggle Q5 Note2 0 0 0 Q3 N/A 1 Q2 RY/BY# No Toggle Toggle 0 0 1
N/A Toggle
Notes:
1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits. See "Q5:Exceeded Timing Limits " for more information.
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ERASE RESUME This command will cause the command register to clear the suspend state and return back to Sector Erase mode but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect in all other conditions. Another Erase Suspend command can be written after the chip has resumed erasing. However, a time delay must be required after the erase resume command, if the system implements an endless erase suspend/resume loop, or the number of erase suspend/ resume is exceeded 1024 times. The erase times will be expended if the erase behavior always be suspended. complement data of the data last written to Q7. Upon completion of the Automatic Program Algorithm an attempt to read the device will produce the true data last written to Q7. The Data# Polling feature is valid after the rising edge of the fourth WE# pulse of the four write pulse sequences for automatic program. While the Automatic Erase algorithm is in operation, Q7 will read "0" until the erase operation is competed. Upon completion of the erase operation, the data on Q7 will read "1". The Data# Polling feature is valid after the rising edge of the sixth WE# pulse of six write pulse sequences for automatic chip/sector erase. The Data# Polling feature is active during Automatic Program/Erase algorithm or sector erase time-out.(see section Q3 Sector Erase Timer)
SET-UP AUTOMATIC PROGRAM COMMANDS To initiate Automatic Program mode, A three-cycle command sequence is required. There are two "unlock" write cycles. These are followed by writing the Automatic Program command A0H. Once the Automatic Program command is initiated, the next WE# pulse causes a transition to an active programming operation. Addresses are latched on the falling edge, and data are internally latched on the rising edge of the WE# pulse. The rising edge of WE# also begins the programming operation. The system does not require to provide further controls or timings. The device will automatically provide an adequate internally generated program pulse and verify margin. If the program operation was unsuccessful, the data on Q5 is "1"(see Table 4), indicating the program operation exceed internal timing limit. The automatic programming operation is completed when the data read on Q6 stops toggling for two consecutive read cycles and the data on Q7 and Q6 are equivalent to data written to these two bits, at which time the device returns to the Read mode(no program verify command is required). DATA# POLLING-Q7 The MX29F200C T/B also features Data# Polling as a method to indicate to the host system that the Automatic Program or Erase algorithms are either in progress or completed. While the Automatic Programming algorithm is in operation, an attempt to read the device will produce the
RY/BY#:Ready/Busy# The RY/BY# is a dedicated, open-drain output pin that indicates whether an Automatic Erase/Program algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to Vcc. If the outputs is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend mode), or is in the standby mode.
Q6:Toggle BIT I Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# pulse in the command sequence(prior to the program or erase operation), and during the sector time-out. During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is complete, Q6 stops toggling.
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After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use Q6 and Q2 together to determine whether a sector is actively erasing or is erase suspended. When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling. When the device enters the Erase Suspend mode, Q6 stops toggling. However, the system must also use Q2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use Q7. If a program address falls within a protected sector, Q6 toggles for approximately 2us after the program command sequence is written, then returns to reading array data. Q6 also toggles during the erase-suspend-program mode, and stops toggling once the Automatic Program algorithm is complete. Table 4 shows the outputs for Toggle Bit I on Q6.
Reading Toggle Bits Q6/ Q2 Whenever the system initially begins reading toggle bit status, it must read Q7-Q0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on Q7-Q0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high (see the section on Q5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as Q5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that system initially determines that the toggle bit is toggling and Q5 has not gone high. The system may continue to monitor the toggle bit and Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation.
Q2:Toggle Bit II The "Toggle Bit II" on Q2, when used with Q6, indicates whether a particular sector is actively erasing (that is, the Automatic Erase algorithm is in process), or whether that sector is erase-suspended. Toggle Bit I is valid after the rising edge of the final WE# pulse in the command sequence. Q2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But Q2 cannot distinguish whether the sector is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sectors and mode information. Refer to Table 4 to compare outputs for Q2 and Q6.
Q5 Exceeded Timing Limits Q5 will indicate if the program or erase time has exceeded the specified limits(internal pulse count). Under these conditions Q5 will produce a "1". This time-out condition which indicates that the program or erase cycle was not successfully completed. Data# Polling and Toggle Bit are the only operating functions of the device under this condition. If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it may not be reused. However, other sectors are still functional and may be used for the program or erase
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MX29F200C T/B
operation. The device must be reset to use other sectors. Write the Reset command sequence to the device, and then execute program or erase command sequence. This allows the system to continue to use the other active sectors in the device. If this time-out condition occurs during the chip erase operation, it specifies that the entire chip is bad or combination of sectors are bad. If this time-out condition occurs during the byte programming operation, it specifies that the entire sector containing that byte is bad and this sector maynot be reused, (other sectors are still functional and can be reused). The time-out condition may also appear if a user tries to program a non blank location without erasing. In this case the device locks out and never completes the Automatic Algorithm operation. Hence, the system never reads a valid data on Q7 bit and Q6 never stops toggling. Once the Device has exceeded timing limits, the Q5 bit will indicate a "1". Please note that this is not a device failure condition since the device was incorrectly used.
DATA PROTECTION The MX29F200C T/B is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power up the device automatically resets the state machine in the Read mode. In addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific command sequences. The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up and powerdown transition or system noise.
TEMPORARY SECTOR UNPROTECT This feature allows temporary unprotection of previously protected sector to change data in-system. The Temporary Sector Unprotect mode is activated by setting the RESET# pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased as un-protected sector. Once VID is remove from the RESET# pin,all the previously protected sectors are protected again.
Q3 Sector Erase Timer After the completion of the initial sector erase command sequence, the sector erase time-out will begin. Q3 will remain low until the time-out is complete. Data# Polling and Toggle Bit are valid after the initial sector erase command sequence. If Data# Polling or the Toggle Bit indicates the device has been written with a valid erase command, Q3 may be used to determine if the sector erase timer window is still open. If Q3 is high ("1") the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by Data# Polling or Toggle Bit. If Q3 is low ("0"), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of Q3 prior to and following each subsequent sector erase command. If Q3 were high on the second status check, the command may not have been accepted.
WRITE PULSE "GLITCH" PROTECTION Noise pulses of less than 5ns(typical) on CE# or WE# will not initiate a write cycle.
LOGICAL INHIBIT Writing is inhibited by holding any one of OE# = VIL, CE# = VIH or WE# = VIH. To initiate a write cycle CE# and WE# must be a logical zero while OE# is a logical one.
POWER SUPPLY DECOUPLING In order to reduce power switching effect, each device should have a 0.1uF ceramic capacitor connected between its VCC and GND.
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MX29F200C T/B
SECTOR PROTECTION WITHOUT 12V SYSTEM The MX29F200C T/B also feature a hardware sector protection method in a system without 12V power suppply. The programming equipment do not need to supply 12 volts to protect sectors. The details are shown in sector protect algorithm and waveform.
CHIP UNPROTECT WITHOUT 12V SYSTEM The MX29F200C T/B also feature a hardware chip unprotection method in a system without 12V power supply. The programming equipment do not need to supply 12 volts to unprotect all sectors. The details are shown in chip unprotect algorithm and waveform.
POWER-UP SEQUENCE The MX29F200C T/B powers up in the Read only mode. In addition, the memory contents may only be altered after successful completion of the predefined command sequences.
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MX29F200C T/B
TEMPORARY SECTOR UNPROTECT OPERATION
Start
RESET# = VID (Note 1) Perform Erase or Program Operation Operation Completed RESET# = VIH Temporary Sector Unprotect Completed(Note 2)
Notes : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V 2. All previously protected sectors are protected again.
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MX29F200C T/B
TEMPORARY SECTOR UNPROTECT
Parameter Std. Description tVIDR tRSP Note: Not 100% tested VID Rise and Fall Time (See Note) RESET# Setup Time for Temporary Sector Unprotect Test Setup Min Min AllSpeed Options Unit 500 4 ns us
TEMPORARY SECTOR UNPROTECT TIMING DIAGRAM
12V
RESET#
0 or 5V Program or Erase Command Sequence 0 or 5V tVIDR
tVIDR
CE#
WE#
tRSP
RY/BY#
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MX29F200C T/B
Parameter Std tREADY1 tREADY2 tRP1 tRP2 tRH tRB1 tRB2
Description RESET# PIN Low (During Automatic Algorithms) to Read or Write (See Note) RESET# PIN Low (NOT During Automatic Algorithms) to Read or Write (See Note) RESET# Pulse Width (During Automatic Algorithms) RESET# High Time Before Read(See Note) RY/BY# Recovery Time(to CE#, OE# go low) RY/BY# Recovery Time(to WE# go low)
Test Setup All Speed Options Unit MAX MAX MIN MIN MIN MIN 20 500 10 500 0 0 50 us ns us ns ns ns ns
RESET# Pulse Width (NOT During Automatic Algorithms) MIN
Note:Not 100% tested
RESET# TIMING WAVEFORM
RY/BY#
CE#, OE#
tRH
RESET#
tRP2 tREADY2
Reset Timing NOT during Automatic Algorithms
tREADY1
RY/BY#
tRB1
CE#, OE#
WE#
tRB2
RESET#
tRP1
Reset Timing during Automatic Algorithms
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MX29F200C T/B
ABSOLUTE MAXIMUM RATINGS
RATING Ambient Operating Temperature Ambient Temperature with Power Applied Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential A9 VALUE -40oC to 85oC -55oC to 125oC -65oC to 125oC -0.5V to 7.0V -0.5V to 7.0V -0.5V to 7.0V -0.5V to 13.5V NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions
MX29F200C T/B -55 Operating Temperature VCC Power Supply Industrial -40oC to 85oC 5V 10% -70 -40oC to 85oC 5V 10% -90 -40oC to 85oC 5V 10%
CAPACITANCE TA = 25oC, f = 1.0 MHz
SYMBOL CIN1 CIN2 COUT PARAMETER Input Capacitance Control Pin Capacitance Output Capacitance MIN. TYP MAX. 8 12 12 UNIT pF pF pF CONDITIONS VIN = 0V VIN = 0V VOUT = 0V
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MX29F200C T/B
READ OPERATION DC CHARACTERISTICS
Symbol PARAMETER ILI ILO ISB1 ISB2 ICC1 ICC2 VIL VIH VOL VOH1 VOH2 Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage(TTL) Output High Voltage(CMOS) 2.4 VCC-0.4 -0.3(Note1) 0.7xVCC Operating VCC current Input Leakage Current Output Leakage Current Standby VCC current 1 MIN. TYP MAX. 1 10 1 5 40 50 0.8 VCC+0.3 0.45 UNIT uA uA mA uA mA mA V V V V V IOL = 2.1mA,VCC=VCC MIN IOH = -2mA,VCC=VCC MIN IOH = -100uA,VCC=VCC MIN CONDITIONS VIN = GND to VCC VOUT = GND to VCC CE# = VIH CE# = VCC + 0.3V IOUT = 0mA, f=5MHz IOUT = 0mA, f=10MHz
NOTES: 1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns. VIL min. = -2.0V for pulse width is equal to ot less than 20 ns. 2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns If VIH is over the specified maximum value, read operation cannot be guaranteed.
AC CHARACTERISTICS
29F200C-55 SYMBOL PARAMETER tACC tCE tOE tDF tOH Address to Output Delay CE# to Output Delay OE# to Output Delay OE# High to Output Float (Note1) Address to Output hold 0 0 MIN. 29F200C-70 29F200C-90 MAX. MIN. 70 70 30 0 0 20 0 0 MAX. UNIT CONDITIONS 90 90 35 20 ns ns ns ns ns CE#=OE#=VIL OE#=VIL CE#=VIL CE#=VIL CE#=OE#=VIL
MAX. MIN. 55 55 30 20
TEST CONDITIONS: * Input pulse levels: 0.45V/0.7xVCC for 70ns & 90ns, 0V/3V for 55ns * Input rise and fall times: is equal to or less than 10ns for 70ns & 90ns, 5ns for 55ns * Output load: 1 TTL gate + 100pF (Including scope and jig) for 70ns & 90ns, 1TTLgate+30pF for 55ns max. * Reference levels for measuring timing: 0.8V, 2.0V for 70ns & 90ns,1.5V for 55ns
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NOTE: 1.tDF is defined as the time at which the output achieves the open circuit condition and data is no longer driven.
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MX29F200C T/B
READ TIMING WAVEFORMS
VIH
A0~16
VIL
ADD Valid
tCE VIH
CE#
VIL
WE#
VIH VIL VIH VIL tACC tOH tOE tDF
OE#
DATA Q0~7
VOH VOL
HIGH Z
DATA Valid
HIGH Z
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MX29F200C T/B
DC CHARACTERISTICS
SYMBOL ICC1 (Read) ICC2 ICC3 (Program) ICC4 (Erase) ICCES VCC Erase Suspend Current 2 PARAMETER Operating VCC Current MIN. TYP MAX. 40 50 50 50 UNIT mA mA mA mA mA CONDITIONS IOUT=0mA, f=5MHz IOUT=0mA, F=10MHz In Programming In Erase CE#=VIH, Erase Suspended
NOTES: 1. VIL min. = -0.6V for pulse width is equal to or less than 20ns. 2. If VIH is over the specified maximum value, programming operation cannot be guaranteed. 3. ICCES is specified with the device de-selected. If the device is read during erase suspend mode, current draw is the sum of ICCES and ICC1 or ICC2. 4. All current are in RMS unless otherwise noted.
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MX29F200C T/B
AC CHARACTERISTICS
TA=-40 C to 85 C, VCC=5V 10% Speed Option SYMBOL tOES tCWC tCEP tCEPH tAS tAH tDS tDH tCESC tDF tAETC tAETB tAVT tBAL tCH tCS PARAMETER OE# setup time Command programming cycle WE# programming pulse width WE# programming pulse width High Address setup time Address hold time Data setup time Data hold time CE# setup time before command write Output disable time (Note 1) Erase time in auto chip erase Erase time in auto sector erase Programming time in auto verify (Byte/Word program time) Sector address load time CE# Hold Time CE# setup to WE# going low MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MAX. TYP. MAX. TYP. MAX. TYP. MAX. MIN. MIN. MIN. 55(Note 2) 0 55 35 20 0 45 35 0 0 20 4 32 0.7 15 9/11 300/360 50 0 0 70 0 70 35 20 0 45 35 0 0 20 4 32 0.7 15 9/11 300/360 50 0 0 90 0 90 45 20 0 45 35 0 0 20 4 32 0.7 15 9/11 300/360 50 0 0 UNIT ns ns ns ns ns ns ns ns ns ns s s s s us us us ns ns
NOTES: 1. tDF defined as the time at which the output achieves the open circuit condition and data is no longer driven. 2. Under condition of VCC=5V10%,CL=30pF,VIH/VIL=3.0V/0V,VOH/VOL=1.5V/1.5V,IOL=2mA,IOH=2mA.
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MX29F200C T/B
SWITCHING TEST CIRCUITS
DEVICE UNDER TEST
2.7K ohm +5V
CL
6.2K ohm
DIODES=IN3064 OR EQUIVALENT
CL=100pF Including jig capacitance for 70ns and 90ns CL=30pF Including jig capacitance for 55ns
SWITCHING TEST WAVEFORMS for 29F200C T/B-70 and 29F200C T/B-90
0.7xVCC
2.0V
2.0V
TEST POINTS
0.8V
0.45V INPUT
0.8V OUTPUT
AC TESTING: Inputs are driven at 0.7xVCC for a logic "1" and 0.45V for a logic "0". Input pulse rise and fall times are < 10ns.
SWITCHING TEST WAVEFORMS for 29F200C T/B-55
3.0V
1.5V
TEST POINTS
1.5V
0V INPUT
OUTPUT
AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0". Input pulse rise and fall times are < 5ns.
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MX29F200C T/B
COMMAND WRITE TIMING WAVEFORM
VCC
5V
ADDRESS A0~16
VIH
ADD Valid
VIL tAS tAH
WE#
VIH VIL tOES tCEPH tCWC
tCEP
CE#
VIH VIL tCS tCH
OE#
VIH VIL VIH tDS tDH
DATA Q0-7
DIN
VIL
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MX29F200C T/B
AUTOMATIC PROGRAMMING TIMING WAVEFORM
One byte data is programmed. Verify in fast algorithm and additional programming by external control are not required because these operations are executed automatically by internal control circuit. Programming completion can be verified by Data# Polling and toggle bit checking after automatic verification starts. Device outputs DATA# during programming and DATA# after programming on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform).
AUTOMATIC PROGRAMMING TIMING WAVEFORM (WORD MODE)
VCC 5V
A11~A16
ADD Valid
A0~A10 WE#
555H
2AAH
555H
ADD Valid
tAS tAH
tCWC tCEPH tAVT tCESC
CE# tCEP OE# tDS tDH Q0~Q2, Q4(Note 1) Q7
Command In Command #AAH Command In Command #55H Command In Command #A0H Data In Command In Command In Command In Data In DATA
tDF
DATA# Polling
DATA# DATA
(Q0~Q7) Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit
tOE
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MX29F200C T/B
AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART (WORD MODE)
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data A0H Address 555H
Write Program Data/Address
Toggle Bit Checking Q6 not Toggled YES
NO
Invalid Command
NO Verify Byte OK
YES NO Auto Program Completed Q5 = 1 YES
Reset
Auto Program Exceed Timing Limit
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MX29F200C T/B
AUTOMATIC CHIP ERASE TIMING WAVEFORM
All data in chip are erased. External erase verification is not required because data is erased automatically by internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure 0n Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform)
AUTOMATIC CHIP ERASE TIMING WAVEFORM (WORD MODE)
VCC 5V
A11~A16
A0~A10 WE#
555H
2AAH
555H
555H
2AAH
555H
tAS tAH
tCWC tCEPH tAETC tCESC
CE# tCEP OE# tDS tDH Q0~Q2 ,Q4(Note 1) Q7
Command In Command #AAH Command In Command #55H Command In Command #80H Command In Command #AAH Command In Command #55H Command In Command #10H Command In Command In Command In Command In Command In Command In
tDF
Data# Polling
(Q0~Q7)
Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit
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MX29F200C T/B
AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART (WORD MODE)
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 10H Address 555H
Toggle Bit Checking Q6 not Toggled YES
NO
Invalid Command
NO
Data# Polling Q7 = 1 YES NO Q5 = 1
Auto Chip Erase Completed
YES Reset
Auto Chip Erase Exceed Timing Limit
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MX29F200C T/B
AUTOMATIC SECTOR ERASE TIMING WAVEFORM
Sector data indicated by A12 to A16 are erased. External erase verification is not required because data are erased automatically by internal control circuit. Erasure completion can be verified by Data# Polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7.(Q6 is for toggle bit; see toggle bit, Data# Polling, timing waveform)
AUTOMATIC SECTOR ERASE TIMING WAVEFORM (WORD MODE)
Vcc 5V
A12~A16
Sector Address0
Sector Address1
Sector Addressn
A0~A10
555H tAS tAH
2AAH
555H
555H
2AAH tCWC
WE#
tCEPH tBAL tAETB
CE#
tCEP
OE#
tDS tDH
Q0,Q1, Q4(Note 1)
Command In
Command In
Command In
Command In
Command In
Command In
Command In
Command In
Data# Polling
Q7
Command In
Command In
Command In
Command In
Command In
Command In
Command In Command #30H
Command In Command #30H
Command #AAH Command #55H Command #80H Command #AAH Command #55H Command #30H (Q0~Q7)
Notes: (1). Q6:Toggle bit, Q5:Timing-limit bit, Q3: Time-out bit, Q2: Toggle bit
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MX29F200C T/B
AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART
START
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 80H Address 555H
Write Data AAH Address 555H
Write Data 55H Address 2AAH
Write Data 30H Sector Address
Toggle Bit Checking Q6 Toggled ?
NO Invalid Command
YES Load Other Sector Addrss If Necessary (Load Other Sector Address)
Last Sector to Erase YES
NO
Time-out Bit Checking Q3=1 ?
NO
YES NO
Toggle Bit Checking Q6 not Toggled YES
NO Data# Polling Q7 = 1 Q5 = 1
YES Reset
Auto Sector Erase Completed
Auto Sector Erase Exceed Timing Limit
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MX29F200C T/B
ERASE SUSPEND/ERASE RESUME FLOWCHART
START
Write Data B0H
ERASE SUSPEND Toggle Bit checking Q6 not toggled YES Read Array or Program NO
Reading or Programming End YES Write Data 30H
NO
Delay 400us (note) ERASE RESUME Continue Erase
Another Erase Suspend ? YES
NO
Note: If the system implements an endless erase suspend/resume loop, or the number of erase suspend/resume is exceeded 1024 times, then the 400us time delay must be put into consideration.
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MX29F200C T/B
TIMING WAVEFORM FOR SECTOR PROTECTION FOR SYSTEM WITHOUT 12V
A1
A6
Toggle bit polling
Verify
5V OE#
tCEP
WE#
* See the following Note!
CE#
Data
Don't care (Note 2) tOE
01H
F0H
A16-A12
Sector Address
Note1: Must issue "unlock for sector protect/unprotect" command before sector protection for a system without 12V provided. Note2: Except F0H
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MX29F200C T/B
TIMING WAVEFORM FOR CHIP UNPROTECTION FOR SYSTEM WITHOUT 12V
A1
A6
Toggle bit polling
Verify
5V OE#
tCEP
WE#
* See the following Note!
CE#
Data
Don't care (Note 2) tOE
00H
F0H
Note1: Must issue "unlock for sector protect/unprotect" command before sector unprotection for a system without 12V provided. Note2: Except F0H
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MX29F200C T/B
SECTOR PROTECTION ALGORITHM FOR SYSTEM WITHOUT 12V
START
PLSCNT=1
Write "unlock for sector protect/unprotect" Command (Table1)
Set Up Sector Addr (A16,A15,A14,A13,A12)
OE#=VIH, A9=VIH CE#=VIL, A6=VIL
Activate WE# Pulse to start Data don't care
Toggle bit checking Q6 not Toggled Yes Increment PLSCNT Set CE#=OE#=VIL A9=VIH
No
No
Read from Sector Addr=SA, A1=1
PLSCNT=32?
No
Data=01H?
Yes Device Failed
Yes Yes
Protect Another Sector? No Write Reset Command
Sector Protection Complete
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MX29F200C T/B
SECTOR UNPROTECTION ALGORITHM FOR SYSTEM WITHOUT 12V
START
Protect All Sectors
PLSCNT=1
Write "unlock for sector protect/unprotect" Command (Table 1)
Set OE#=A9=VIH CE#=VIL,A6=1
Activate WE# Pulse to start Data don't care
No
Toggle bit checking DQ6 not Toggled Yes Set OE#=CE#=VIL A9=VIH,A1=1
Increment PLSCNT
Set Up First Sector Addr
Read Data from Device No
Increment Sector Addr
Data=00H?
No PLSCNT=1000?
Yes No
Yes Device Failed
All sectors have been verified? Yes Write Reset Command
Chip Unprotect Complete
* It is recommended before unprotect the whole chip, all sectors should be protected in advance.
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MX29F200C T/B
ID CODE READ TIMING WAVEFORM
VCC
5V VID VIH VIL
ADD A9
tACC
tACC
A1
VIH VIL
ADD A2-A8 A10-A17 CE#
VIH VIL
VIH VIL
WE#
VIH VIL
tCE
OE#
VIH VIL
tOE tDF tOH tOH
VIH
DATA Q0-Q15
DATA OUT
VIL
DATA OUT 51H/57H (Byte mode) 2251H/2257H (Word mode)
C2H/00C2H
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MX29F200C T/B
RECOMMENDED OPERATING CONDITIONS
At Device Power-Up AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate correctly.
VCC(min)
VCC
GND
tVR tR or tF tACC tR or tF
VIH
ADDRESS
VIL
Valid Address
tF tCE tR
VIH
CE#
VIL
VIH
WE#
VIL
tF
VIH
tOE
tR
OE#
VIL
VOH
DATA
High Z
VOL
Valid Ouput
Figure A. AC Timing at Device Power-Up
Symbol tVR tR tF
Parameter VCC Rise Time Input Signal Rise Time Input Signal Fall Time
Notes 1 1,2 1,2
Min. 20
Max. 500000 20 20
Unit us/V us/V us/V
Notes : 1. Sampled, not 100% tested. 2. This specification is applied for not only the device power-up but also the normal operations.
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MX29F200C T/B
ERASE AND PROGRAMMING PERFORMANCE(1)
PARAMETER Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Chip Programming Time Byte Mode Word Mode Erase/Program Cycles Note: 100,000 MIN. LIMITS TYP.(2) 0.7 4 9 11 2.3 1.5 MAX.(3) 15 32 300 360 6.8 4.5 UNITS sec sec us us sec sec Cycles
1. Not 100% Tested, Excludes external system level over head. 2. Typical values measured at 25 C,5V. 3. Maximum values measured at worst condition: 90 C, 4.5V, 100K cycles.
LATCH-UP CHARACTERISTICS
MIN. Input Voltage with respect to GND on all pins except I/O pins Input Voltage with respect to GND on all I/O pins Current Includes all pins except Vcc. Test conditions: Vcc = 5.0V, one pin at a time. -1.0V -1.0V -100mA MAX. 13.5V VCC + 1.0V +100mA
DATA RETENTION
PARAMETER Data Retention Time MIN. 20 UNIT Years
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MX29F200C T/B
ORDERING INFORMATION
PART NO. MX29F200CTMI-55 MX29F200CTMI-70 MX29F200CTMI-90 MX29F200CTTI-55 MX29F200CTTI-70 MX29F200CTTI-90 MX29F200CBMI-55 MX29F200CBMI-70 MX29F200CBMI-90 MX29F200CBTI-55 MX29F200CBTI-70 MX29F200CBTI-90 MX29F200CTMI-55G MX29F200CTMI-70G MX29F200CTMI-90G MX29F200CTTI-55G MX29F200CTTI-70G MX29F200CTTI-90G MX29F200CBMI-55G MX29F200CBMI-70G MX29F200CBMI-90G MX29F200CBTI-55G MX29F200CBTI-70G MX29F200CBTI-90G ACCESS TIME (ns) 55 70 90 55 70 90 55 70 90 55 70 90 55 70 90 55 70 90 55 70 90 55 70 90 OPERATING Current MAX. (mA) 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type)
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PACKAGE
Remark
Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free Pb-free
39
MX29F200C T/B
PART NAME DESCRIPTION
MX 29
F 200 C T T I
70 G
OPTION: G: Lead-free package blank: normal SPEED: 55:55ns 70:70ns 90:90ns TEMPERATURE RANGE: I: Industrial (-40 C to 85 C) PACKAGE: M:SOP T: TSOP BOOT BLOCK TYPE: T: Top Boot B: Bottom Boot
REVISION: C DENSITY & MODE: 200: 2M, x8/x16 Boot Sector TYPE: F: 5V DEVICE: 29: Flash
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MX29F200C T/B
PACKAGE INFORMATION
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MX29F200C T/B
P/N:PM1250
REV. 1.0 , DEC. 14, 2005
42
MX29F200C T/B
REVISION HISTORY
Revision No. Description 1.0 1. Removed "Preliminary" title 2. Removed commercial grade 3. Added access time: 55ns Page P1 All All Date DEC/14/2005
P/N:PM1250
REV. 1.0 , DEC. 14, 2005
43
MX29F200C T/B
MACRONIX INTERNATIONAL CO., LTD.
Headquarters:
TEL:+886-3-578-6688 FAX:+886-3-563-2888
Europe Office :
TEL:+32-2-456-8020 FAX:+32-2-456-8021
Hong Kong Office :
TEL:+86-755-834-335-79 FAX:+86-755-834-380-78
Japan Office :
Kawasaki Office :
TEL:+81-44-246-9100 FAX:+81-44-246-9105
Osaka Office :
TEL:+81-6-4807-5460 FAX:+81-6-4807-5461
Singapore Office :
TEL:+65-6346-5505 FAX:+65-6348-8096
Taipei Office :
TEL:+886-2-2509-3300 FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-262-8887 FAX:+1-408-262-8810
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.

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